Electrolytic copper plating method
US6444110B1 · kind B1 · utility
39Cited by
20References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 1999 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | May 17, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.