Seed layer repair method
US6531046B2 · kind B2 · utility
17Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2000 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Dec 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76873
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.