Sangsick Park
5Patents
0h-index
13Co-inventors
31Inventor score
Filing activity: Jun 18, 2020 → May 26, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11469099B2 | Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages | Electricity | 0 | Active |
| US11362062B2 | Semiconductor package | Electricity | 0 | Active |
| US11688707B2 | Semiconductor package | Electricity | 0 | Active |
| US12176313B2 | Semiconductor package | Electricity | 0 | Active |
| US11791308B2 | Semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.