Sean Chang
11Patents
7h-index
23Co-inventors
66Inventor score
Filing activity: Oct 22, 2004 → Dec 4, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8119527B1 | Depositing tungsten into high aspect ratio features | Electricity | 416 | Active |
| US8435894B2 | Depositing tungsten into high aspect ratio features | Electricity | 296 | Active |
| US8124531B2 | Depositing tungsten into high aspect ratio features | Electricity | 57 | Active |
| US8207062B2 | Method for improving adhesion of low resistivity tungsten/tungsten nitride layers | Electricity | 39 | Active |
| US8835317B2 | Depositing tungsten into high aspect ratio features | Electricity | 31 | Active |
| US9034768B2 | Depositing tungsten into high aspect ratio features | Electricity | 28 | Active |
| US8889233B1 | Method for reducing stress in porous dielectric films | Electricity | 14 | Active |
| US9659769B1 | Tensile dielectric films using UV curing | Electricity | 6 | Active |
| US11865773B2 | Additive process for circular printing of electronic devices | Emerging Cross-Sectional Technologies | 1 | Active |
| US12172374B2 | Additive process for circular printing | Emerging Cross-Sectional Technologies | 0 | Active |
| US11487206B2 | Methods and apparatus for digital material deposition onto semiconductor wafers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.