Inventor · Suwon-si, KR

Seung Yeop Lee

22Patents
2h-index
39Co-inventors
53Inventor score

Filing activity: Apr 30, 2009 → Aug 31, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US10262972B2 Semiconductor packages including stacked chips Electricity 9 Active
US8233015B2 Display apparatus and method of manufacturing the same Emerging Cross-Sectional Technologies 3 Active
US9184137B2 Semiconductor chip and semiconductor package having the same Electricity 2 Active
US9397024B2 Semiconductor devices with optical through via structures, memory cards including the same, and electronic systems including the same Electricity 2 Active
US11004831B2 Stack packages including a fan-out sub-package Electricity 1 Active
US7999370B2 Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the same Electricity 1 Active
US11195827B2 Semiconductor integrated circuit device including an electro-static discharge protection circuit Electricity 0 Active
US8616875B2 Light guide plate stamp and method of manufacturing the same Performing Operations; Transporting 0 Active
US11164833B2 Semiconductor device using wires and stacked semiconductor package Electricity 0 Active
US9181114B2 Mineralogical removal method and apparatus for highly concentrated iodine in radioactive wastewater Chemistry; Metallurgy 0 Active
US11309098B2 Mineralogical method and apparatus for removal of aqueous cesium ion Physics 0 Active
US8816360B2 Multi-chip package cross-reference to related applications Electricity 0 Active
US11759897B2 Part assembling system of automation line Emerging Cross-Sectional Technologies 0 Active
US12065951B2 Apparatus and method for assembling an engine Mechanical Engineering; Lighting; Heating 0 Active
US11158626B2 Semiconductor integrated circuit device including an electrostatic discharge protection circuit Electricity 0 Active
US9034614B2 Method of preparing alkyl butyrate from fermented liquid using microorganisms Chemistry; Metallurgy 0 Active
US11742340B2 Semiconductor package including stacked semiconductor chips Electricity 0 Active
US11309303B2 Semiconductor package including stacked semiconductor chips Electricity 0 Active
US10337035B2 Method for preparing organic acid by fed-batch-feeding carbon source substrate and base Chemistry; Metallurgy 0 Active
US8772937B2 Semiconductor device including inner interconnection structure able to conduct signals or voltages in the semiconductor chip with vertical connection vias and horizontal buried conductive lines Electricity 0 Active
US9888567B2 Flexible device including sliding interconnection structure Electricity 0 Active
US11152335B2 Stack packages including a supporting substrate Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.