Polishing apparatus and polishing method
US8696924B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 4, 2007 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Jun 16, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus is used for polishing and planarizing a substrate such as a semiconductor wafer on which a conductive film such as a copper (Cu) layer or a tungsten (W) layer is formed. The polishing apparatus includes a polishing table having a polishing surface, a motor for rotating the polishing table, a top ring for holding a substrate and pressing the substrate against the polishing surface, a film thickness measuring sensor disposed in the polishing table for scanning a surface of the substrate, and a computing device for processing signals of the film thickness measuring sensor to compute a film thickness of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.