Electric potential shaping apparatus for holding a semiconductor wafer during electroplating
US6193859A · kind A · utility
74Cited by
54References
29Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 7, 1998 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | May 7, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for depositing an electrically conductive layer on the surface of a wafer comprises a flange. The flange has a cylindrical wall and an annulus attached to a first end of the cylindrical wall. The annulus shields the edge region of the wafer surface during electroplating reducing the thickness of the deposited electrically conductive layer on the edge region. Further, the cylindrical wall of the flange can be provided with a plurality of apertures adjacent the wafer allowing gas bubbles entrapped on the wafer surface to readily escape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.