Sun Goo Lee
8Patents
6h-index
17Co-inventors
56Inventor score
Filing activity: Feb 28, 2003 → Jul 14, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6995459B2 | Semiconductor package with increased number of input and output pins | Electricity | 94 | Expired |
| US6876068B1 | Semiconductor package with increased number of input and output pins | Electricity | 78 | Expired |
| US6927483B1 | Semiconductor package exhibiting efficient lead placement | Electricity | 69 | Expired |
| US6879034B1 | Semiconductor package including low temperature co-fired ceramic substrate | Electricity | 25 | Expired |
| US6750545B1 | Semiconductor package capable of die stacking | Electricity | 21 | Expired |
| US6833619B1 | Thin profile semiconductor package which reduces warpage and damage during laser markings | Electricity | 16 | Expired |
| US9971083B2 | Directional backlight unit | Physics | 2 | Active |
| US9829660B2 | Optical module | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.