Method of manufacturing semiconductor wafer
US6080641A · kind A · utility
4Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1997 |
| Grant date | Jun 27, 2000 |
| Priority date | — |
| Expiry date | May 19, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/974
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is disclosed a method of manufacturing semiconductor wafers, in which a lapping process is performed prior to a chamfering process. This makes it possible to manufacture semiconductor wafers while maintaining the smoothness and dimensional accuracy of a chamfered surface of each wafer obtained by the chamfering process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.