Teemu Lang
8Patents
6h-index
9Co-inventors
45Inventor score
Filing activity: Jun 26, 2003 → Apr 3, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7021330B2 | Diaphragm valve with reliability enhancements for atomic layer deposition | Emerging Cross-Sectional Technologies | 364 | Expired |
| US7030430B2 | Transition metal alloys for use as a gate electrode and devices incorporating these alloys | Electricity | 69 | Expired |
| US7141095B2 | Precursor material delivery system for atomic layer deposition | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6941963B2 | High-speed diaphragm valve for atomic layer deposition | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6907897B2 | Diaphragm valve for high-temperature precursor supply in atomic layer deposition | Emerging Cross-Sectional Technologies | 14 | Expired |
| US7198820B2 | Deposition of carbon- and transition metal-containing thin films | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7193253B2 | Transition metal alloys for use as a gate electrode and devices incorporating these alloys | Electricity | 6 | Expired |
| US7191793B2 | Diaphragm valve for atomic layer deposition | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.