Thomas Ortleb
3Patents
1h-index
5Co-inventors
30Inventor score
Filing activity: Feb 21, 2008 → Apr 17, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7899570B2 | Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback | Electricity | 4 | Active |
| US7781329B2 | Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices | Electricity | 0 | Active |
| US8323471B2 | Automatic deposition profile targeting | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.