Patent · US Active

Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback

US7899570B2 · kind B2 · utility

4Cited by

19References

18Claims

0Family size

Assignee

Advanced Micro Devices, Inc. · US

Inventors

Thomas Ortleb · Dresden, DE
Markus Nopper · Dresden, DE
Thomas Harold Roessler · Menasha, US

Key dates

Filing date	Feb 27, 2008
Grant date	Mar 1, 2011
Priority date	—
Expiry date	Sep 16, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The present disclosure relates to automatic deposition profile targeting with a combined deposition/polishing apparatus which obtains matching deposition and subsequent polishing profiles by use of feedback data from an advanced polish endpoint system in an advanced process control system.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.