Patent · US Active

Automatic deposition profile targeting

US8323471B2 · kind B2 · utility

0Cited by

3References

17Claims

0Family size

Assignee

Advanced Micro Devices, Inc. · US

Inventors

Thomas Ortleb · Dresden, DE
Markus Nopper · Dresden, DE
Dirk Wollstein · Dresden, DE

Key dates

Filing date	Feb 21, 2008
Grant date	Dec 4, 2012
Priority date	—
Expiry date	Oct 14, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of automatic deposition profile targeting for electrochemically depositing copper with a position-dependent controllable plating tool including the steps of depositing copper on a patterned product wafer, measuring an actual thickness profile of the deposited copper and generating respective measurement data, feeding the measurement data to an advanced process control (APC) model and calculating individual corrections for plating parameters in the position-dependent controllable plating tool.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.