Ting-Ke Chai
3Patents
3h-index
9Co-inventors
36Inventor score
Filing activity: Dec 5, 2000 → Jun 14, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6359342B1 | Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same | Electricity | 14 | Expired |
| US6555924B2 | Semiconductor package with flash preventing mechanism and fabrication method thereof | Electricity | 12 | Expired |
| US6650015B2 | Cavity-down ball grid array package with semiconductor chip solder ball | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.