Semiconductor package with flash preventing mechanism and fabrication method thereof
US6555924B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Aug 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package and a fabricating method thereof are proposed, in which a substrate is prepared for having at least one flash preventing mechanism disposed on a surface of the substrate corresponding to a position in front of an entry of an air vent in a mold. After a semiconductor chip is mounted on the substrate by a plurality of conductive elements, a molding compound having high fluidity and fine filler particles is used to encapsulate the chip and the flash preventing mechanism. As the flash preventing mechanism is disposed in a manner of reducing the entry space of the air vent, the flow of the molding compound is impeded by the flash preventing mechanism, making the molding compound rapidly absorb heat of the mold and accordingly increased in viscosity. This helps prevent flash of the molding compound from occurrence, and assure the semiconductor package in quality and profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.