Tiong C. Go
5Patents
5h-index
2Co-inventors
45Inventor score
Filing activity: Apr 25, 1986 → Jun 24, 1991
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4706166A | High-density electronic modules--process and product | Electricity | 299 | Expired |
| US5104820A | Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | Electricity | 276 | Expired |
| US4764846A | High density electronic package comprising stacked sub-modules | Emerging Cross-Sectional Technologies | 241 | Expired |
| US4983533A | High-density electronic modules - process and product | Emerging Cross-Sectional Technologies | 239 | Expired |
| US4912545A | Bonding of aligned conductive bumps on adjacent surfaces | Electricity | 44 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.