Vicky Ochoa
4Patents
4h-index
11Co-inventors
40Inventor score
Filing activity: Jun 26, 1996 → Aug 10, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6309956A | Fabricating low K dielectric interconnect systems by using dummy structures to enhance process | Emerging Cross-Sectional Technologies | 88 | Expired |
| US5886410A | Interconnect structure with hard mask and low dielectric constant materials | Electricity | 66 | Expired |
| US6027995A | Method for fabricating an interconnect structure with hard mask and low dielectric constant materials | Electricity | 39 | Expired |
| US6037249A | Method for forming air gaps for advanced interconnect systems | Electricity | 29 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.