William Jeffrey Schaefer
9Patents
7h-index
8Co-inventors
52Inventor score
Filing activity: Aug 2, 1989 → Apr 30, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6084308A | Chip-on-chip integrated circuit package and method for making the same | Electricity | 137 | Expired |
| US6075290A | Surface mount die: wafer level chip-scale package and process for making the same | Electricity | 136 | Expired |
| US6023094A | Semiconductor wafer having a bottom surface protective coating | Electricity | 67 | Expired |
| US6175162A | Semiconductor wafer having a bottom surface protective coating | Electricity | 49 | Expired |
| US6770513B1 | Thermally enhanced flip chip packaging arrangement | Electricity | 12 | Expired |
| USRE38789E1 | Semiconductor wafer having a bottom surface protective coating | General | 12 | Expired |
| US6800815B1 | Materials and structure for a high reliability bga connection between LTCC and PB boards | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7287323B1 | Materials and structure for a high reliability BGA connection between LTCC and PB boards | Emerging Cross-Sectional Technologies | 2 | Expired |
| US4972885A | Power module for special purpose woodworking tools | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.