Sloped interconnector for stacked die package
US11756932B2 · kind B2 · utility
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1References
14Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 30, 2020 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Nov 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15159
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a mechanical support structure that provides mechanical support to a stack of dies, where the dies are laterally offset from each other. The support structure has a sloped surface that is disposed at a non-perpendicular and non-parallel angle to other surfaces of the mechanical support structure. Electrical contacts are disposed on the sloped surface of the mechanical support structure for electrically interfacing with the stacked dies and on a different surface of the mechanical support structure for electrically interfacing with a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.