Y. Lee
3Patents
2h-index
4Co-inventors
27Inventor score
Filing activity: Nov 28, 2001 → Aug 20, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6686615B1 | Flip-chip type semiconductor device for reducing signal skew | Electricity | 17 | Expired |
| US6605480B2 | Wafer level packaging for making flip-chips | Electricity | 2 | Expired |
| US7005054B2 | Method for manufacturing probes of a probe card | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.