Flip-chip type semiconductor device for reducing signal skew
US6686615B1 · kind B1 · utility
17Cited by
2References
5Claims
0Family size
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Key dates
| Filing date | Aug 20, 2002 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Aug 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip type semiconductor device for reducing signal skew includes: a chip with bonding pads, and a plurality of bumping pads on the chip. Between each bonding pad and corresponding bumping pads is connected with a metal redistribution trace covered by a passivation layer. Each metal trace has an equal trace length for reducing signal skew.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.