Method for manufacturing probes of a probe card
US7005054B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 20, 2002 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Oct 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0367
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.