Ya-Yi Cheng
12Patents
2h-index
29Co-inventors
46Inventor score
Filing activity: Mar 1, 2018 → Jul 20, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10847411B2 | Conductive feature formation and structure | Electricity | 11 | Active |
| US10535748B2 | Method of forming a contact with a silicide region | Electricity | 3 | Active |
| US10475702B2 | Conductive feature formation and structure using bottom-up filling deposition | Electricity | 1 | Active |
| US10943823B2 | Conductive feature formation and structure using bottom-up filling deposition | Electricity | 0 | Active |
| US10804140B2 | Interconnect formation and structure | Electricity | 0 | Active |
| US11411094B2 | Contact with a silicide region | Electricity | 0 | Active |
| US12328890B2 | Contact with a silicide region | Electricity | 0 | Active |
| US12272600B2 | Contact features of semiconductor device and method of forming same | Electricity | 0 | Active |
| US12417945B2 | Contact features of semiconductor device and method of forming same | Electricity | 0 | Active |
| US12308292B2 | Methods of forming semiconductor device structures | Electricity | 0 | Active |
| US11532503B2 | Conductive feature structure including a blocking region | Electricity | 0 | Active |
| US12237218B2 | Method of fabricating contact structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.