Semiconductor package for chip with testing contact pad connected to outside
US6642735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2001 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Dec 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package for chip with testing contact pad includes a chip, a plurality of leads, at least a flow-conducting plate, and a molding compound. The chip has an active surface provided with a plurality of functional contact pads and at least a testing contact pad. The leads are bonded onto the active surface of the chip and respectively connected to the functional contact pads through a plurality of functional wires. The flow-conducting plate is connected to the testing contact pad through at least a testing wire. The molding compound encapsulates the chip, the leads, the flow-conducting plate, the functional contact pads, and the testing contact pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.