You Ock Joo
6Patents
6h-index
4Co-inventors
45Inventor score
Filing activity: Jan 5, 2005 → Sep 7, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7700411B2 | Semiconductor device package and manufacturing method | Electricity | 72 | Active |
| US7633170B2 | Semiconductor device package and manufacturing method thereof | Electricity | 62 | Expired |
| US7656047B2 | Semiconductor device package and manufacturing method | Electricity | 35 | Active |
| US7166917B2 | Semiconductor package having passive component disposed between semiconductor device and substrate | Electricity | 21 | Expired |
| US7439098B2 | Semiconductor package for encapsulating multiple dies and method of manufacturing the same | Electricity | 16 | Expired |
| US7833837B2 | Chip scale package and method for manufacturing the same | Electricity | 9 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.