Semiconductor device package and manufacturing method
US7656047B2 · kind B2 · utility
35Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2007 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Sep 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The electromagnetic interference shielding layer is a plated metal layer in contact with the package body, and the plated metal layer is connected to a ground trace extending on the upper surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.