Semiconductor package having passive component disposed between semiconductor device and substrate
US7166917B2 · kind B2 · utility
21Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2005 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Feb 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor device and a passive component mounted and electrically coupled to a substrate. The passive component is disposed within a cavity portion formed on an upper surface of the substrate and the semiconductor device is disposed across the cavity portion of the substrate above the passive component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.