Youjun Wang
10Patents
4h-index
31Co-inventors
56Inventor score
Filing activity: Nov 13, 2006 → Dec 21, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7394152B2 | Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same | Electricity | 36 | Active |
| USD815738S1 | Electrosurgical pencil | General | 17 | Active |
| US7663213B2 | Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same | Electricity | 17 | Active |
| USD818761S1 | Mixer | General | 15 | Active |
| USD818764S1 | Mixer | General | 3 | Active |
| US8174090B2 | Packaging structure | Electricity | 1 | Active |
| US9256981B2 | Method and device for processing geological information | Physics | 0 | Active |
| US12309467B2 | Video splitting method and electronic device | Electricity | 0 | Active |
| US11902636B2 | Video splitting method and electronic device | Electricity | 0 | Active |
| US11120037B2 | Test data integration system and method thereof | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.