Polymer-based microfabricated thermal ground plane
US9921004B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2015 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Oct 29, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0108
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.