Yunglun Lin
8Patents
1h-index
11Co-inventors
37Inventor score
Filing activity: May 19, 2016 → Mar 20, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10032805B2 | Method for bonding pins in outer lead bonding area | Physics | 2 | Active |
| US10423039B2 | Array substrate and manufacturing method thereof | Electricity | 1 | Active |
| US10330997B2 | Array substrate and manufacturing method thereof | Electricity | 1 | Active |
| US11262627B2 | Liquid crystal display panel and display device | Physics | 0 | Active |
| US11360592B2 | Display panel and method of manufacturing thereof | Physics | 0 | Active |
| US11373608B2 | Display panel and display device | Physics | 0 | Active |
| US11181788B2 | Display panel | Physics | 0 | Active |
| US11908804B2 | Array substrate and display panel | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.