Method for simultaneous structuring and chip singulation
US10005659B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2017 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Feb 23, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24273
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A hole plate and a MEMS microphone arrangement are disclosed. In an embodiment a hole plate includes a substrate with a first main surface, a second main surface, and a lateral surface and a perforation structure formed within the substrate, the perforation structure having a plurality of through-holes through the substrate, wherein the through-holes and the lateral surface are a result of a simultaneous dry etching step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.