Optical method and system for defects detection in three-dimensional structures
US10018574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2015 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Jul 14, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An inspection system and method are presented for inspecting structures having a pattern formed by an array of elongated grooves having high aspect-ratio geometry, such as semiconductor wafers formed with vias. The inspection system comprises an imaging system and a control unit. The imaging system is configured and operable for imaging the structure with a dark-field imaging scheme and generating a dark-field image. The control unit comprises an analyzer module for analyzing pixels brightness in the dark-field image for identifying a defective groove, being a groove characterized by pixels brightness in the dark-field image lower than nominal brightness by a predetermined factor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.