Source/drain performance through conformal solid state doping
US10032628B2 · kind B2 · utility
447Cited by
678References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2016 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | May 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for improving source/drain performance through conformal solid state doping and its resulting device are disclosed. Specifically, the doping takes place through an atomic layer deposition of a dopant layer. Embodiments of the invention may allow for an increased doping layer, improved conformality, and reduced defect formation, in comparison to alternate doping methods, such as ion implantation or epitaxial doping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.