Patent · US Active

Semiconductor chip package having contact pins at short side edges

US10037934B2 · kind B2 · utility

0Cited by

6References

17Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Ralf Otremba · Kaufbeuren, DE
Chooi Mei Chong · Melaka City, MY
Raynold Talavera Corocotchia · Melaka City, MY
Teck Sim Lee · Melaka City, MY
Sanjay Kumar Murugan · Melaka City, MY
Klaus Schiess · Allensbach, DE
Chee Voon Tan · Seremban, MY
Wee Boon Tay · Melaka City, MY

Key dates

Filing date	Feb 4, 2016
Grant date	Jul 31, 2018
Priority date	—
Expiry date	Feb 4, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact elements connected with the semiconductor chip and extending outwardly. The encapsulation body has six side faces and the electrical contact elements extend exclusively through two opposing side faces which have the smallest surface areas from all the side faces. The semiconductor chip is disposed on the chip pad, and a main face of the chip pad remote from the semiconductor chip is at least partially exposed to the outside.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.