Sensor structures, systems and methods with improved integration and optimized footprint

US10060816B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thoralf Kautzsch · Dresden, DE
• Heiko Froehlich · Radebeul, DE
• Mirko Vogt · Dresden, DE
• Maik Stegemann · Freital, DE
• Andre Roeth · Dresden, DE
• Bernhard Winkler · Birkenfeld, DE
• Boris Binder · Dresden, DE

Key dates

• Filing date: Dec 8, 2016
• Grant date: Aug 28, 2018
• Expiry date: Dec 8, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2203/0127
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual points or feet-like elements, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.