Test board unit and apparatus for testing a semiconductor chip including the same
US10060969B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Sep 4, 2015 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | May 17, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0408
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test board unit may include a test board, a thermal tank and a heat-dissipating plate. The test board may be configured to provide a semiconductor chip with a test current. The thermal tank may be configured to dissipate heat generated in the semiconductor chip. The heat-dissipating plate may be coupled between the test board and the thermal tank and may be configured to transfer the heat from the semiconductor chip to the thermal tank.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.