System and method for bi-facial processing of substrates
US10062600B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2015 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | May 17, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67754
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. The carriers are configured for supporting substrates of different sizes. The carriers are also configured for flipping the substrates such that both surfaces of the substrates may be processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.