Patent · US Active

Circuit board embedding a power semiconductor chip

US10062671B2 · kind B2 · utility

2Cited by

4References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Martin Gruber · Schwandorf, DE
Angela Kessler · Regensburg, DE
Thorsten Scharf · Regensburg, DE

Key dates

Filing date	Apr 21, 2016
Grant date	Aug 28, 2018
Priority date	—
Expiry date	Aug 4, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L25/16
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module includes a circuit board and a power semiconductor chip embedded in the circuit board. The power semiconductor chip has a first load electrode. The semiconductor module further includes a power terminal connector electrically connected to the first load electrode. The embedded power semiconductor chip is positioned laterally within a footprint zone of the power terminal connector.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.