Orbital polishing with small pad
US10076817B2 · kind B2 · utility
2Cited by
15References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2014 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Mar 26, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.