Patent · US Active

Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers

US10090159B2 · kind B2 · utility

0Cited by

4References

14Claims

0Family size

Assignee

BASF SE

Inventors

Yongqing Lan · Potsdam, US
Peter Przybylski · Ludwigshafen, DE
Zhenyu Bao · Potsdam, US
Julian Proelss · Allschwil, CH

Key dates

Filing date	May 5, 2014
Grant date	Oct 2, 2018
Priority date	—
Expiry date	Jul 28, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/3212
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

Described is a chemical-mechanical polishing (CMP) composition comprising the following components: (A) surface modified silica particles having a negative zeta potential of −15 mV or below at a pH in the range of from 2 to 6 (B) one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.