Method and device for cooling a heat generating component
US10091909B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2015 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Jan 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.