Reducing temperature transition in a substrate support
US10096506B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2018 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Feb 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A temperature controller for a substrate processing system includes an interface configured to receive a processing temperature corresponding to a desired processing temperature of a substrate. The temperature controller includes a thermal control element controller configured to selectively control a thermal control element to adjust a temperature of a substrate support. The thermal control element controller is further configured to, prior to the substrate being loaded onto the substrate support, determine at least one of a temperature of the substrate support and a temperature of the substrate and, based on the processing temperature and the at least one of the temperature of the substrate support and the temperature of the substrate, control the thermal control element to adjust the temperature of the substrate support to a setpoint temperature that is different than the processing temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.