Encapsulated microelectromechanical structure
US10099917B2 · kind B2 · utility
0Cited by
224References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2017 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Aug 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
After forming a microelectromechanical-system (MEMS) resonator within a silicon-on-insulator (SOI) wafer, a complementary metal oxide semiconductor (CMOS) cover wafer is bonded to the SOI wafer via one or more eutectic solder bonds that implement respective paths of electrical conductivity between the two wafers and hermetically seal the MEMS resonator within a chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.