Inventor · Belmont, CA, US

Pavan Gupta

24Patents
8h-index
9Co-inventors
68Inventor score

Filing activity: May 6, 1994 → Apr 22, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US8022554B2 Stacked die package for MEMS resonator system Electricity 25 Active
US8324729B2 Stacked die package for MEMS resonator system Electricity 17 Active
US8871551B2 Wafer encapsulated microelectromechanical structure and method of manufacturing same Electricity 16 Active
US9692567B1 Targeted service request for small data communication in a network environment Electricity 15 Active
US8941247B1 Stacked die package for MEMS resonator system Electricity 12 Active
US8669664B2 Stacked die package for MEMS resonator system Electricity 10 Active
US9371221B2 Low-profile stacked-die MEMS resonator system Electricity 9 Active
US9821998B2 Stacked-die MEMS resonator system Electricity 8 Active
US10287162B2 Low-profile stacked-die MEMS resonator system Electricity 6 Active
US5430713A Frequency hopping in digital cellular networks Electricity 5 Expired
US10723617B2 Package structure for micromechanical resonator Electricity 4 Active
US10913655B2 Manufacturing of integrated circuit resonator Electricity 4 Active
US11370656B2 Stacked-die MEMS resonator Electricity 3 Active
US11708264B2 Stacked-die MEMS resonator Electricity 1 Active
US9060294B2 System and method for throttling downlink data notifications in a network environment Electricity 1 Active
US11987495B2 MEMS resonator system Electricity 1 Active
US10450190B2 Encapsulated microelectromechanical structure Electricity 0 Active
US10766768B2 Encapsulated microelectromechanical structure Electricity 0 Active
US10099917B2 Encapsulated microelectromechanical structure Electricity 0 Active
US9434608B2 Wafer encapsulated microelectromechanical structure Electricity 0 Active
US11685650B2 Microelectromechanical structure with bonded cover Electricity 0 Active
US12365582B2 MEMS resonator integrated cicruit fabrication Electricity 0 Active
US9440845B2 Encapsulated microelectromechanical structure Electricity 0 Active
US9758371B2 Encapsulated microelectromechanical structure Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.