Thrumold post package with reverse build up hybrid additive structure
US10103038B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2017 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Aug 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices having a semiconductor die electrically coupled to a redistribution structure and a molded material over the redistribution structure are disclosed herein, along with associated systems and methods. In one embodiment, a semiconductor device includes a semiconductor die attached to a first side of a substrate-free redistribution structure, and a plurality of conductive columns extending through a molded material disposed on the first side of the redistribution structure. The semiconductor device can also include a second redistribution structure on the molded material and electrically coupled to the conductive columns. A semiconductor device can be manufactured using a single carrier and requiring processing on only a single side of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.