Integrated waveguide structure and socket structure for millimeter waveband testing
US10114067B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2016 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Feb 27, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/045
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A structure for signal transmission is disclosed. The structure comprises a first plurality of waveguides tightly disposed together and disposed substantially in parallel with each other, each of said waveguides having a first opening and a second opening, wherein each first opening is operable to align with a patch antenna, and wherein the first plurality of waveguides is disposed adjacent to a socket. The integrated structure further comprises the socket which comprises an opening operable to support an insertion of a device under test (DUT), wherein the DUT is communicatively coupled to a plurality of microstrip transmission lines on a printed circuit board (PCB) underlying the socket for transmitting test signals from the DUT, wherein each of the microstrip transmission lines is electrically coupled to a respective patch antenna. Further, the first plurality of waveguides and the socket are integrated into a single plastic or metal structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.