Apparatus and techniques to treat substrates using directional plasma and point of use chemistry
US10128082B2 · kind B2 · utility
1Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2015 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Jul 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3244
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In one embodiment, an apparatus to treat a substrate may include an extraction plate to extract a plasma beam from a plasma chamber and direct the plasma beam to the substrate. The plasma beam may comprise ions forming a non-zero angle of incidence with respect to a perpendicular to a plane of the substrate; and a gas outlet system disposed outside the plasma chamber, the gas outlet system coupled to a gas source and arranged to deliver to the substrate a reactive gas received from the gas source, wherein the reactive gas does not pass through the plasma chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.