Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body
US10128593B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2017 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Sep 28, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention include a method for fabricating a hybrid land grid array connector and the resulting structures. A body is provided. The body includes a first plurality of holes and a second plurality of holes. A conductive layer is deposited on the top and bottom surfaces of the body and the wall surfaces of the first plurality of holes resulting in the top and bottom surfaces being electrically common. The conductive layer is removed from the wall surfaces of a first subset of the first plurality of holes. A portion of the conductive layer is removed from the top surface of the body and the bottom surface of the body from an area surrounding the first subset of the first plurality of holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.