Semiconductor wafer inspection using care area group-specific threshold settings for detecting defects
US10146036B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2016 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Mar 31, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In the methods and systems, optical images of inspection care areas on a semiconductor wafer are acquired and analyzed to detect defects. However, during this analysis, the same threshold setting is not used for all inspection care areas. Instead, care areas are grouped into different care area groups, based on different design layouts and properties. Each group is associated with a corresponding threshold setting that is optimal for detecting defects in the inspection care areas belonging to that group. The assignment of the care areas to the different groups and the association of the different threshold settings with the different groups are noted in an index. This index is accessible during the analysis and used to ensure that each of the inspection care areas in a specific care area group is analyzed based on a corresponding threshold setting that is optimal for that specific care area group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.