Electromagnetic interference shielding for system-in-package technology
US10163810B2 · kind B2 · utility
3Cited by
1References
19Claims
0Family size
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Inventors
Key dates
| Filing date | Dec 26, 2015 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Dec 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments are generally directed to electromagnetic interference shielding for system-in-package technology. An embodiment of a system-in-package includes a substrate; chips and components attached to the substrate; dielectric molding over the chips and components; and an electromagnetic interference (EMI) shield. The EMI shield formed from a conductive paste, and the EMI shield provides a combined internal EMI shield between chips and components of the system in package and external EMI shield for the system-in-package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.